Latest News
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May 10, 2012Successful participation at „National Electrical Wire Processing Expo" in Milwaukee, USA
TELSONIC AG exhibited at this year’s „National Electrical Wire Processing Expo“ in Milwaukee.
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Apr 24, 2012Innovation in communication: TELSONIC gets its own BeeTagg
Two new instruments for communication involving new media have recently been introduced: TELSONIC's own BeeTagg and inventive cleaning pads for smartphones.
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Apr 20, 2012TELSONIC headquarters in Bronschhofen gets a facelift
The company's headquarters in Bronschhofen, Switzerland is in the middle of a major facelift. The second phase of construction, is due to be completed in September 2012.
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Apr 4, 2012TELSONIC relaunches online
The new TELSONIC website went live recently. Its clear and transparent structure enables visitors to find the information they are looking for quickly, giving them a vital insight into the various areas of our business.
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Sep 1, 2011Bread for the World
Clean flour in one pass: An old process re-discovered and technologically realised for the first time
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Apr 1, 2011The Best of Two Worlds
The new impulse sealing process from TELSONIC AG unites ultrasonic welding with thermal sealing in one process.
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